나노여과에 의한 중금속 함유 산성 폐에칭액의 재생(II) : 구리이온을 함유한 PCB 폐에칭액의 Dead-end 나노여과
Recycling of Acidic Etching Waste Solution Containing Heavy Metals by Nanofiltration (II) : Dead-end Nanofiltration of PCB Etching Waste Solution Containing Copper Ion
(Received February 19, 2013, Revised February 25, 2013, Accepted February 26, 2013)
Abstract
In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copperion (Cu+2) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studiedfor the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtainthe basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experimentswere carried out with a dead-end membrane filtration laboratory system. The pure water flux was increased with theincreasing storage time in sulfuric acid solution and lowering pH of acid solution because of the enhancement of NF membranedamage by sulfuric acid. The permeate flux of acid solution was decreased with the increasing copper ionconcentration. Total rejection of copper ion was decreased with the increasing storage time in sulfuric acid solution andcopper ion concentration, and lowering the pH of acid solution. The total rejection of copper ion was decreased from initial37% to 15% minimum value.
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